http://www.extremetech.com/wp-content/uploads/2015/05/a-silicon-wafer-in-sand-maybe-640x353.jpg 640w" sizes="(max-width: 300px) 100vw, 300px" />A new semiconductor report projects that 2D planar scaling will end by 2021, replaced by 3D logic integration and stacked chips — but how will this affect long-term device scaling and overall performance? Moore’s law scaling dead by 2021, to be replaced by 3D integration
http://www.extremetech.com/wp-content/uploads/2015/05/a-silicon-wafer-in-sand-maybe-640x353.jpg 640w" sizes="(max-width: 300px) 100vw, 300px" />A new semiconductor report projects that 2D planar scaling will end by 2021, replaced by 3D logic integration and stacked chips — but how will this affect long-term device scaling and overall performance? Subscribe to iCameroon.Com Newsletter
